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Two Days Left to Save: AIVC Third TightVent Workshop

Wednesday, April 10, 2013  
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Don’t wait! The pre-registration rate ends this Friday, April 12, 2013, for the workshop highlighting the latest on building and ductwork air tightness. Scheduled for April 18-19, 2013, the Third TightVent Workshop on Building and Ductwork Airtightness, being held in the Washington, D.C., metropolitan area, will feature more than 30 expert professionals delivering presentations on topics related to the theme: Design, Implementation, Control and Durability: Feedback from Practice and Perspectives.

Save $50 by registering now!

The pre-registration rate of $400 (US) ends April 12. Onsite registration is $450 (US). (Registration includes materials and meals.)

Join us and gain insights from the experts and exhibitors.

Speakers will address the following topics: Policy and Requirements; Product Characterization – Innovative Sealing Technologies; Design and Quality Control – Energy Impacts; and Measurement Methods, Field Campaigns and Data Analysis.

Exhibitors will present products and services demonstrating advancements in sealing techniques; durability; test methods and analyses; and challenges and solutions for high-rise buildings.

The International Network for Information on Ventilation and Energy Performance (INIVE) is organizing this workshop on behalf of the Air Infiltration and Ventilation Centre (AIVC); the National Institute of Building Sciences Building Enclosure Technology and Environment Council (BETEC); and the TightVent Building and Ductwork Airtightness Platform.

Technical and/or financial support comes from the following organizations: the National Institute of Standards and Technology (NIST); INIVE; the International Energy Agency Energy Conservation in Buildings and Community Systems Programme; the National Institute of Building Sciences; Lawrence Berkeley National Laboratory; TightVent Europe; and ASHRAE.

Reserve your seat today!

See the list of speaker presentations.

View the schedule of events.

Register now.

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